I. Technological evolution and market demand

1.1 Development history

• Traditional BTB: 0.5mm pitch, 30-50pin
• High Density BTB: 0.35mm pitch, 100-200pin
• Next Generation Trends: 0.2mm pitch, 300pin+

1.2 Comparison of Key Performance Indicators

II. Core technology breakthroughs

2.1 Precision manufacturing process

• Stamping accuracy: ±5μm (0.35mm pitch)
• injection molding: LCP material, flow length ratio > 100
• Plating technology::
  • Hard gold plating (0.2μm)
  • Selective Plating (Cost Reduction 30%)

2.2 Innovative contact structures

• Double beam contact design: Chart Code Download PCB pad Upper contact beam Lower contact beam together to form a four-point contact
• Self-cleaning contacts: Sliding friction design to remove oxidized layers

2.3 High-speed signal integrity

• impedance control: 100Ω ± 10% (differential pair)
• crosstalk suppression::
  • Grounding pin 1:4 configuration
  • Embedded shield (thickness 15μm)
• insertion loss optimization: <0.3dB@10GHz

III. Typical application programs

3.1 Folding screen cell phones

• Shaft connection program::
  • 6-layer flexible board + 4 sets of BTBs
  • Dynamic bending radius <3mm
• Reliability Testing::
  • 200,000 times folding test
  • Vibration testing (20G, 3-axis)

3.2 Camera Module

• Multi-Board Stacking Design: Chart Code Download BTBBTB Sensor Boards ISP Boards Interface Boards
• Alignment accuracy: ±25μm (active alignment technology)

3.3 Vehicle electronics

• Waterproof Model::
  • IP67 protection rating
  • Salt spray resistance test (500h)
• Anti-vibration design::
  • Secondary locking mechanism
  • 10-2000Hz random vibration test

IV. Materials and supply chain

4.1 Key materials

• contactors: C7025 copper alloy (tensile strength 800 MPa)
• heat insulation::
  • LCP (temperature resistance 260°C)
  • PPS (cost-oriented)
• plating solution::
  • Cyanide-free gold plating solution (environmentally friendly)
  • Pulse plating technology (uniformity enhancement)

4.2 Cost structure

• Material percentage::
  • Metal parts: 45%
  • Plastic parts: 30%
  • Plating: 15%
• processing cost::
  • Precision stamping：￥0.008/pin
  • Automatic assembly：￥0.02/position

V. Testing and reliability

5.1 Mechanical testing

• Insertion force curve: Chart Code Download Rendering Failure
• Durability Test::
  • Contact resistance change <10% after 500 insertions/removals

5.2 Environmental testing

• temperature cycling::
  • -40℃~125℃, 1000 cycles
  • Resistance change rate <5%
• Damp Heat Test::
  • 85°C/85%RH, 1000h
  • Insulation resistance >100MΩ

VI. Future technology trends

6.1 Ultra-micro-pitch development

• 0.2mm Pitch Challenge::
  • Board-to-board coplanarity <15μm
  • New alignment guide structure
• Mixed Arrangement Design::
  • Power/signal pin differential spacing

6.2 High-speed evolution

• 56Gbps PAM4 support::
  • Differential intra-pair delay <5ps
  • Crosstalk <-40dB@28GHz
• Optical Hybrid Connection::
  • Integrated Fibre Channel (experimental phase)

VII. Industry Pain Points and Countermeasures

7.1 Main challenges

• precision limit: 0.2mm pitch yield <80%
• High frequency loss: Steep insertion loss above 28 GHz
• cost pressure: High-density BTBs are three times more expensive than conventional ones

7.2 Solutions

1. design innovation::
   • Self-aligning structure (±50μm tolerance)
   • Impedance Gradient Matching
2. Process breakthroughs::
   • Nanoimprint Technology
   • Roll-to-roll continuous production
3. Test Optimization::
   • 3D X-ray auto-detection
   • High-speed ICT test coverage >95%